ThSim provides simulation of temperatures in solid material. It uses SPICE to do the actual calculations. An electrical equivalent model is used in order to describe the thermal properties of the entered blocks of solid material. The simulation is limited to conduction; no flow or convection is included. The main usage of this software is to simulate short duration thermal effects of high power dissipation, for instance for semiconductor devices. It allows analyses for short time durations, where measurements are not possible. This tool provides a simple solution for thermal analyses in applications where the additional capabilities of high-end tools for simulation of thermal convection and flow are not necessary. The program uses wxWindows for the GUI and OpenGL for the 3D graphics output.
|Tags||multimedia Graphics 3D Modeling|
|Operating Systems||POSIX Linux Windows Windows Windows Windows|
Release Notes: This release updates OpenGL with zooming (using the mouse wheel) and sliding (using the right button) functions, and fixes a number of bugs.
Release Notes: The Linux installation was updated and now installs German GUI files. Support for the LT-SPICE simulator was added.
Release Notes: This version fixes documentation for "set filetype=binary", as it is supposed to work now with all SPICE3 versions.
No changes have been submitted for this release.